Molecular dynamics simulation of microwelds formation and breakage during ultrasonic copper wire bonding

authored by

Yangyang Long, Bo He, Weizhe Cui, Xiaoying Zhuang, Jens Twiefel

Organisation(s)

Institute of Dynamics and Vibration Research
Institute of Continuum Mechanics

Type

Conference contribution

Pages

1434-1439

No. of pages

6

Publication date

07.08.2018

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1109/ectc.2018.00219 (Access: Closed)