Molecular dynamics simulation of microwelds formation and breakage during ultrasonic copper wire bonding

authored by
Yangyang Long, Bo He, Weizhe Cui, Xiaoying Zhuang, Jens Twiefel
Organisation(s)
Institute of Dynamics and Vibration Research
Institute of Continuum Mechanics
Type
Conference contribution
Pages
1434-1439
No. of pages
6
Publication date
07.08.2018
Publication status
Published
Peer reviewed
Yes
ASJC Scopus subject areas
Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering
Electronic version(s)
https://doi.org/10.1109/ectc.2018.00219 (Access: Closed)