Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading
- verfasst von
- Bilen Emek Abali, Fadi Aldakheel, Tarek I. Zohdi
- Abstract
Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.
- Organisationseinheit(en)
-
Institut für Kontinuumsmechanik
- Externe Organisation(en)
-
Uppsala University
University of California at Berkeley
- Typ
- Beitrag in Buch/Sammelwerk
- Seiten
- 1-14
- Anzahl der Seiten
- 14
- Publikationsdatum
- 13.03.2022
- Publikationsstatus
- Elektronisch veröffentlicht (E-Pub)
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.), Informatik (insg.)
- Elektronische Version(en)
-
https://doi.org/10.1007/978-3-030-87312-7_1 (Zugang:
Geschlossen)
